Remote plasma cleaning source technology for complex ultra-high vacuum systems

FERMI INSTRUMENTS has successfully developed a new generation of remote plasma cleaning sources for in-situ removal of carbon contamination in complex vacuum systems.

Low-pressure gas is excited by external energy to generate plasma, including different components such as electrons, ions, neutral atoms or groups. Relying on the "activation effect" of active particles to perform physical bombardment and chemical reaction with the surface of the object, the required substances are converted into volatile substances, which can be removed by vacuuming. Compared with conventional chemical cleaning, plasma surface treatment does not need to distinguish the type of substrate to be treated. Except for some electrically sensitive equipment, it can be used for a variety of materials such as metals and organics. It does not produce harmful pollution and has low overall cost. In addition, it can also improve the surface adhesion of materials. Therefore, it is widely used in plasma cleaning, surface treatment and other fields.

The samples to be treated in traditional plasma cleaning machines need to be placed inside the cleaning machine, and cannot be processed inside large and complex vacuum systems; while the plasma surface treatment system developed by Fermion Instruments for the inside of the vacuum system has achieved cleaning and micro-polishing without damage to the inner wall of the ultra-high vacuum cavity, but it is necessary to set up discharge electrodes inside the cavity, and there are still many restrictions on its use.

At present, Fermion Instruments has developed a new generation of remote plasma cleaning source, which cancels the internal electrode design of the cavity, making it safer and more convenient. The system is suitable for ultra-high vacuum working environment. During the working process, other vacuum components do not need to be removed, and subsequent baking can be performed without removing the cleaning source, so that the vacuum system can maintain a good vacuum degree for a longer time.  

▲Plasma cleaning of complex ultra-high vacuum systems

The working pressure of the new generation plasma cleaning source ranges from E-3 mbar to 1 mbar, and the working gas selection is wide to match the removal of different types of pollutants. According to actual needs, the ions and activated molecules in the plasma can be separated to avoid ion bombardment from damaging the surface or heating the sample. Only activated components, such as oxygen atoms and active oxygen molecules, react with organic matter to remove surface contamination.

▲Small plasma cleaning chamber

In practice, according to the different needs of the actual chamber or components, silicon wafers, etc., the ion source power and gas pressure are adjusted to quickly obtain a completely clean and oxide-free surface, even remote corners can be effectively cleaned, thereby maintaining the cleanliness of the vacuum environment.

▲Plasma cleaning machine

▲Plasma cleaning machine cleaning

FERMI Instruments INSTRUMENTS) has long been committed to providing precision instruments, core technologies, and overall solutions for global scientific research institutions, major national instrument projects, and high-end industrial needs. The plasma cleaning system developed this time can be used for complex vacuum interconnection systems to avoid secondary pollution caused by opening cavities. The process is easy to control and the cleaning accuracy is high. It can effectively remove organic matter such as grease and oil, as well as oxide layers and deposited residues, creating a good experimental environment. We warmly welcome customers to contact us.