Robotically Driven Cryogenic Cleaving Stage

Crystal cleavage refers to the separation of the crystal fracture surface along a certain crystal plane (i.e., cleavage plane) under the action of normal stress; Unlike two-dimensional layered materials, the layers are bonded by strong covalent bonds or ionic bonds, while the interlayers are mostly bonded by weaker van der Waals forces. Generally, a simple ceramic stick plus glue method can be used to peel off fresh and high-quality crystal planes; but for materials that tend to be three-dimensional in structure, such as metals, it is difficult to obtain a smooth cleavage plane due to the strong interlayer force.

The ultra-high vacuum low-temperature in-situ cleavage system developed by Fermion Instruments can well protect the fresh sample surface in an ultra-high vacuum environment. Low temperature can increase the brittleness of the sample and obtain a smoother cleavage plane. The device is vacuum-connected with the surface analysis equipment, which can realize the whole process of in-situ Cleavage and transfer, satisfying the experimental research of surface properties of various materials by different users, and expanding the sample sources for angle-resolved photoelectron spectrometer (ARPES) and scanning tunneling microscope (STM).