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The ultra-high vacuum low-temperature in-situ cleavage system developed by Fermion Instruments can well protect the fresh sample surface in an ultra-high vacuum environment. The low temperature can increase the brittleness of the sample and obtain a smoother cleavage surface. The equipment is vacuum-connected with the surface analysis equipment to realize the entire process of in-situ cleavage and transfer, which can meet the experimental research of different users on the surface properties of various materials and expand the richer sample sources for angle-resolved photoelectron spectroscopy (ARPES) and scanning tunneling microscopy (STM).
| ● Cylinder-driven cutter head | ● Equipped with liquid nitrogen cooling, the lowest temperature is less than 120K | ● The cleavage surface can achieve atomic-level flatness |
| ● Maximum cross-sectional size 5mmx5mm | ● Can cleave semiconductor single crystals and hard ion crystals | ● Standard sample holder, can be integrated into surface analysis equipment such as ARPES, STM, XPS, etc. |
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