Remote plasma cleaning source technology for complex ultra-high vacuum systems

FERMI INSTRUMENTS has successfully developed a new generation of remote plasma cleaning sources for in-situ removal of carbon contamination in complex vacuum systems.

Low-pressure gas is stimulated by external energy to produce plasma, including different components such as electrons, ions, neutral atoms or groups. Relying on the "activation effect" of active particles, it performs physical bombardment and chemical reaction with the surface of the object, turning the desired removal substances into volatile substances, which can be removed by vacuuming. Compared with conventional chemical cleaning, plasma surface treatment does not need to distinguish the type of substrate to be treated, except for some electrically sensitive equipment. It can be used for a variety of materials such as metals and organic matter, does not produce harmful pollution, has low overall cost, and can also improve the surface adhesion of materials. Therefore, it is widely used in plasma cleaning, surface treatment and other fields.

At present, Fermion Instruments has developed a new generation of remote plasma cleaning source, which cancels the internal electrode design of the cavity, making it safer and more convenient. The system is suitable for ultra-high vacuum working environment. During the working process, other vacuum components do not need to be removed, and subsequent baking can be performed without removing the cleaning source, so that the vacuum system can maintain a good vacuum degree for a longer period of time.  

▲Plasma cleaning of complex ultra-high vacuum system

The new generation of plasma cleaning sources has a working pressure ranging from E-3 mbar to 1 mbar, and a wide range of working gas options to match the removal of different types of pollutants. The ions and activated molecules in the plasma can be separated according to actual needs to avoid ion bombardment from damaging the surface or heating the sample, and only the activated components, such as oxygen atoms, active oxygen molecules, etc., react with organic matter to remove surface contamination.

▲Small plasma cleaning chamber

In practice, the ion source power and gas pressure are adjusted according to the actual chamber or components, silicon wafers and other different needs, and a completely clean and oxide-free surface can be quickly obtained. Even remote corners can be effectively cleaned, thereby maintaining the cleanliness of the vacuum environment.

▲Plasma cleaning machine

▲Plasma cleaning machine cleaning

FERMI INSTRUMENTS has long been committed to providing precision instruments, core technologies, and overall solutions for global scientific research institutions, major national instrument projects, and high-end industrial needs. The plasma cleaning system developed this time can be used for The complex vacuum interconnection system avoids secondary pollution caused by opening the cavity. The process is easy to control and the cleaning precision is high. It can effectively remove organic matter such as grease and oil, as well as the oxide layer and sediment residue, creating a good experimental environment. We warmly welcome customers to contact us.