FERMI INSTRUMENTS has successfully developed a new generation of remote plasma cleaning sources for in-situ removal of carbon contamination in complex vacuum systems.
Low-pressure gas is excited by external energy to generate plasma, including different components such as electrons, ions, neutral atoms or groups. Relying on the "activation effect" of active particles to perform physical bombardment and chemical reaction with the surface of the object, the required substances are converted into volatile substances, which can be removed by vacuuming. Compared with conventional chemical cleaning, plasma surface treatment does not need to distinguish the type of substrate to be treated. Except for some electrically sensitive equipment, it can be used for a variety of materials such as metals and organic matter. It does not produce harmful pollution and has low overall cost. In addition, it can also improve the surface adhesion of materials, so it is widely used in plasma cleaning, surface treatment and other fields.
The samples to be treated in traditional plasma cleaning machines need to be placed inside the cleaning machine, and cannot be treated inside large and complex vacuum systems; while the plasma surface treatment system developed by Fermion Instruments for the inside of the vacuum system has achieved cleaning and micro-polishing without damaging the inner wall of the ultra-high vacuum chamber, but it is necessary to set up discharge electrodes inside the chamber, and there are still many restrictions on its use.At present, Fermion Instruments has developed a new generation of remote plasma cleaning source, which eliminates the internal electrode design of the cavity, making it safer and more convenient. The system is suitable for ultra-high vacuum working environment. During the working process, other vacuum components do not need to be removed, and subsequent baking can be performed without removing the cleaning source, so that the vacuum system can maintain a good vacuum degree for a longer period of time.
▲ Complex ultra-high vacuum system plasma cleaning
The new generation of plasma cleaning sources has a working pressure ranging from E-3 mbar to 1 mbar, and a wide range of working gases are available to match the removal of different types of pollutants. The ions and activated molecules in the plasma can be separated according to actual needs to avoid ion bombardment from damaging the surface or heating the sample. Only activated components, such as oxygen atoms and reactive oxygen molecules, react with organic matter to remove surface contamination.
▲Compact plasma cleaning chamber
In practice, the ion source power and gas pressure are adjusted according to the actual chamber or components, silicon wafers and other different needs, and a completely clean and oxide-free surface can be quickly obtained. Even remote corners can be effectively cleaned, thereby maintaining the cleanliness of the vacuum environment.
▲Plasma cleaning machine
▲Plasma cleaning machine cleaning
FERMI INSTRUMENTS has long been committed to providing precision instruments, core technologies, and overall solutions for global scientific research institutions, major national instrument projects, and high-end industrial needs. The plasma cleaning system developed this time can be used for complex vacuum interconnection systems to avoid secondary pollution caused by opening cavities. The process is easy to control and the cleaning accuracy is high. It can effectively remove organic matter such as grease and oil, as well as oxide layers and deposited residues, creating a good experimental environment. We warmly welcome customers to contact us.